BD2326_1 Datasheet, PDF (1/4 Pages) BeRex Corporation – Triple Band 2‐Way SMT Power Divider

BD2326
Triple Band 2‐Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD‐SCDMA, WiBro
Device Features
 Typical Isola on = 20.0 dB
 Typical Inser on Loss = 0.6 dB
 MSL 1 moisture ra ng
 Small Size and Low Profile
 Lead‐free/RoHS‐compliant SOT‐26 Plas c Package
BD23XX(XX=Wafer number)
Product Descrip on
BeRex’s Divider BD2326 is designed for PCS,
WCDMA & TD‐SCDMA and WiBro band with
low Inser on Loss and Isola on. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS‐
compliant with SOT‐26 surface mount pack‐
age.
Typical Performance¹
Parameter
Min Typical Max Unit
Frequency Range
1900
2500 MHz
Inser on Loss
0.65 0.9
dB
Isola on
15
20
dB
IRL(S11)
‐15
‐10 dBm
ORL(S22/S33)
Amplitude Balance
Phase Balance
‐22
‐18 dBm
0.06 0.2
dB
0.8
1.0
deg
*All specifica ons apply to the following test condi ons,
1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.
2. Inser on Loss: Above 3.0dB.
Applica ons
 Base sta on Infrastructure
 Commercial/Industrial/Military wireless system
Absolute Maximum Ra ngs
Parameter
Input Power
Storage Temperature
Opera ng Temperature
Ra ng
1W CW dBm
‐55 to +155°C
‐40 to +85°C
Opera on of this device above any of these parameters may result in permanent damage.
Evalua on Board Drawing
Func on Block Diagram
Pins 2,4 and 6 must be DC and RF grounded.
BeRex
●website: www.berex.com
●email: [e-mail]
Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
1
Rev. C