BD19B Datasheet, PDF (1/5 Pages) BeRex Corporation – Dual Band 2-Way SMT Power Divider 1700~2300MHz PCS, WCDMA & TD-SCDMA

BeRex
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
BD19B
Device Features and Description
 23dB Typical Isolation
 0.4dB Typical Insertion Loss
 Small Size and Low Profile
 MSL 1 moisture rating
 Lead-free/Green/RoHS compliant package
 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
 Chip is fully passivated for enhanced performance and reliability
 Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Unit
Min
Typ
Frequency Range
MHz
1700
Insertion Loss
dB
0.4
Isolation
dB
15
23
IRL(S11)
dB
-20
ORL(S22,S33)
dB
-25
Amplitude Balance
dB
1.0
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Max
2300
0.8
-15
-15
2.0
Absolute Maximum Ratings
Parameters
Rating
Input Power
1W CW
Storage Temperature
-55 to +155C
Operating Temperature
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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