BD09B Datasheet, PDF (1/5 Pages) BeRex Corporation – Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900

BeRex
Dedicated Band 2-Way SMT Power Divider
700~1000MHz Cellular & GSM900
BD09B
Device Features and Description
 23 dB Typical Isolation
 0.5 dB Typical Insertion Loss
 Small Size and Low Profile
 MSL 1 moisture rating
 Lead-free/Green/RoHS compliant package
Application: commercial, space, military wireless system
 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
 Chip is fully passivated for enhanced performance and reliability
 Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Unit
Min
Typ
Frequency Range
MHz
700
Insertion Loss
dB
0.5
Isolation
dB
15
23
IRL(S11)
dB
-20
ORL(S22,S33)
dB
-23
Amplitude Balance
dB
0.05
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Max
1000
0.8
-15
-15
0.2
Absolute Maximum Ratings
Parameters
Rating
Input Power
1W CW
Storage Temperature
-55 to +155C
Operating Temperature
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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