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BL8509B Datasheet, PDF (6/10 Pages) SHANGHAI BELLING CO., LTD. – Ultra-small package High-precision Voltage Detector with delay
BL8509B
Directions for use:
1、 Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or
permanent damage to the device.
2、When a resistor is connected between the VDD pin and the input with CMOS output configurations, oscillation may
occur as a result of voltage drops at RIN if load current(IOUT) exists.(refer to the Oscillation Description(1) below)
3、When a resistor is connected between the VDD pin and the input with CMOS output configurations, oscillation may
occur as a result of through current at the time of voltage release even if load current(IOUT) does not exist. (refer
to the Oscillation Description(2) below)
4、With a resistor connected between the VDD and the input, detect and release voltage will rise as a result of the IC’s
supply current flowing through the VDD pin.
5、In order to stabilize the IC’s operations, please ensure that VDD pin’s input frequency’s rise and fall times are more
than several u Sec/V.
Oscillation Description:
1、 Output current oscillation with the CMOS output configuration
When the voltage applied at IN rises, release operations commence and the detector’s output voltage increase.
Load current(IOUT) will flow at RL. Because a voltage drop(RIN*IOUT) is produces at the RIN resistor, located
between the input(IN) and the VDD pin. The load current will flow via the IC’s pin. The voltage drop will also lead to
a fall in the voltage level at the VDD pin. When the VDD pin voltage level falls below the detect voltage level, detect
operations will commence. Fllowing detect operations, load current flow will cease and since voltage drop at RIN
will disapper, the voltage level at the VDD pin will rise and release operations will begin over again. Oscillation
may occur with this “release-detect-release” repetition. Further, this condition will also appear via means of a
similar mechanism during detect operations.
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