SLIN-12F2AX Datasheet, PDF (24/25 Pages) Bel Fuse Inc. – 2.4 Vdc - 5.5 Vdc Input, 0.6 Vdc - 3.63 Vdc /12 A Output

NON-ISOLATED DC/DC CONVERTERS
2.4 Vdc - 5.5 Vdc Input, 0.6 Vdc - 3.63 Vdc /12 A Output
December 2, 2010
Bel Power Inc., a subsidiary of Bel Fuse Inc.
Surface Mount Information
Pick and Place
The SLIN-12F2Ax modules use an open frame construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface mount processing, as well as safety standards, and
is able to withstand reflow temperatures of up to 300^oC. The label carries product information such as part
number and serial number.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle
size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The
minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer
diameter, which will safely fit within the allowable component spacing, is 7 mm.
Bottom Side/ First Side Assembly
This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is
attempted, components may fall off the module during the second reflow process.
Lead Free Soldering
The SLIN-12F2Ax modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions may result in the
failure of or cause damage to the modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This
standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the
package. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). A 6 mil thick stencil is recommended. The
recommended linear reflow profile using Sn/Ag/Cu solder is shown below. Soldering outside of the recommended
profile requires testing to verify results and performance.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
200
150
Heating Zone
1°C/Se cond
100
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
50
0
Reflow Time (Seconds)
Recommended linear reflow profile using Sn/Ag/Cu solder
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302 • Tel [phone] • Fax [phone] • www.belfuse.com
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