F1206A Datasheet, PDF (7/12 Pages) AVX Corporation – SMD Thin-Film Fuse

Accu-Guard^®
SMD Thin-Film Fuse
RECOMMENDED SOLDERING PROFILES
IR REFLOW
220
210
200
190
180
170 Assembly enters the
160 ^{preheat zone}
Additional soak time
to allow uniform
heating of the
substrate
150
140
130
120
110
100
90
80
Soak time
1) Activates the flux
70
2) Allows center of board
temperatures to catch up with
60
corners
50
40
30
20
0
0.5
1
1.5
2
2.5
Assembly exits heat–
no forced cooldown
45-60 sec.
above solder
melting point
186°C solder melting
temperature
3
3.5
4
4.5
Time (mins)
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lousy bypass to the
device. Various recommended cleaning conditions (which
must be optimized for the flux system being used) are as
follows:
Cleaning liquids . . . . . . . .i-propanol, ethanol, acetylace-
tone, water, and other stan-
dard PCB cleaning liquids.
Ultrasonic conditions . . . .power – 20w/liter max. fre-
quency – 20kHz to 45kHz.
Temperature . . . . . . . . . .80°C maximum (if not other-
wise limited by chosen solvent
system).
Time . . . . . . . . . . . . . . . .5 minutes max.
WAVE SOLDERING
260
240
220
200
180
160
140
120
100
80
60
40
20
0
100°C
3–5 seconds
Natural
Cooling
Enter Wave
Time (seconds)
10 20 30 40 50 60 70 80 90 100 110 120
STORAGE CONDITIONS
Recommended storage conditions for Accu-Guard^®
prior to use are as follows:
Temperature
15°C to 35°C
Humidity
≤65%
Air Pressure
860mbar to 1060mbar
VAPOR PHASE
215°C
200
180
160
140
120
100
80
60
40
20
Preheat
0
Time (minutes)
Transfer from
preheat with
min. delay &
temp. loss
215°C
200
180
160
140
120
100
80
60
40
20
Reflow
Duration varies
with thermal mass
of assembly
10–60 secs typical
Enter
Vapor
Natural
Cooling
0 _{10 20 30 40 50 60 70}
Time (seconds)