GG020105100N2P Datasheet, PDF (6/8 Pages) AVX Corporation – AVX GiGUARD ESD PROTECTION DIODES

GiGuard - ESD Protection for High Speed Circuits
TEMPERATURE DERATING
DIMENSIONS
L
W
t
T
mm (inches)
Size
0201
0402
Length (L)
Width (W)
Thick (T) Termination (t)
0.60 ± 0.03 0.30 ± 0.03 0.30 ± 0.03 0.15 ± 0.05
(0.024 ± 0.001) (0.012 ± 0.001) (0.012 ± 0.001) (0.006 ± 0.002)
1.00 ± 0.05 0.60 ± 0.05 0.50 ± 0.05 0.20 ± 0.05
(0.039 ± 0.002) (0.024 ± 0.002) (0.020 ± 0.002) (0.008 ± 0.002)
RECOMMENDED REFLOW SOLDER PAD
D
A
CB
A
mm (inches)
Size
0201
0402
A
B
C
D
0.25 ± 0.05 0.30 ± 0.05 0.80 ± 0.15 0.275 ± 0.025
(0.010 ± 0.002) (0.012 ± 0.002) (0.031 ± 0.006) (0.011 ± 0.001)
0.61 ± 0.05 0.51 ± 0.05 1.70 ± 0.05 0.51 ± 0.05
(0.024 ± 0.002) (0.020 ± 0.002) (0.067 ± 0.002) (0.020 ± 0.002)
RECOMMENDED SOLDER REFLOW PROFILES
Recommended Reflow Profiles
275
Pb Free Recommended
250
Pb Free Max with care
Sn Pb Recommended
225
200
175
150
125
100
75
50
25
0
20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Time / secs
Hand Soldering Cautions
In hand soldering of the Devices. Large temperature gradient
between preheated the Devices and the tip of soldering iron
may cause electrical failures and mechanical damages such as
cracking or breaking of the devices. The soldering shall be
carefully controlled and carried out so that the temperature
gradient is kept minimum with following recommended
conditions for hand soldering.
RECOMMENDED SOLDERING CONDITION 1
(1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with
soldering flux in the core Rosin-based and non-activated
flux is recommended.
(2) Preheating: The Devices shall be preheated so that
Temperature Gradient between the devices and the tip of
soldering iron is 150℃ or below.
(3) Soldering Iron: Rated Power of 20w max with 3mm
soldering tip in diameter. Temperature of soldering iron tip
300ºCmax, 3-5sec (The required amount of solder shall be
melted in advance on the soldering tip.)
(4) Cooling: After soldering. The Devices shall be cooled
gradually at room ambient temperature.
RECOMMENDED SOLDERING CONDITION 2 –
WITHOUT PREHEATING
(1) Temperature of soldering iron tip 300℃max, 3-5sec.
(2) Solder iron tip shall not directly touch to Devices.
(3) Solder iron tip shall be fully preheated before soldering while
soldering iron tip to the external electrode of Devices.
6
020217