F98_15 Datasheet, PDF (3/3 Pages) AVX Corporation – Resin-Molded Chip, High CV Undertab

F98 Series
Resin-Molded Chip, High CV Undertab
QUALIFICATION TABLE
Damp Heat
(Steady State)
Temperature Cycles
Resistance to
Soldering Heat
Surge
Endurance
Shear Test
Terminal Strength
At 40°C, 90 to 95% R.H., 500 hours (No voltage applied)
Capacitance Change ........... Refer to page 67 (*1)
Dissipation Factor ................ 150% or less of initial specified value
Leakage Current .................. 200% or less of initial specified value
-55°C / +125°C, 30 minutes each, 5 cycles
Capacitance Change ........... Refer to page 67 (*1)
Dissipation Factor ................ 150% or less of initial specified value
Leakage Current .................. 200% or less of initial specified value
10 seconds reflow at 260°C, 5 seconds immersion at 260°C.
Capacitance Change ........... Refer to page 67 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
After application of surge in series with a 1kΩ resistor at the rate of 30 seconds ON, 30 seconds OFF,
for 1000 successive test cycles at 85ºC, capacitors shall meet the characteristic requirements in the table above.
Capacitance Change ........... Refer to page 67 (*1)
Dissipation Factor ................ 150% or less of initial specified value
Leakage Current .................. 200% or less of initial specified value
After 1000 hours’ application of rated voltage in series with a 3Ω resistor at 85°C,
capacitors shall meet the characteristic requirements in the table above.
Capacitance Change ........... Refer to page 67 (*1)
Dissipation Factor ................ 150% or less of initial specified value
Leakage Current .................. 200% or less of initial specified value
After applying the pressure load of 5N for 10±1 seconds horizontally to the center of capacitor side body
which has no electrode and has been soldered beforehand on a substrate, there shall be found neither
exfoliation nor its sign at the terminal electrode.
Keeping a capacitor surface-mounted on a substrate upside down and supporting the substrate at
both of the opposite bottom points 45mm apart from the center of capacitor, the pressure strength is
applied with a specified jig at the center of substrate so that the substrate may bend by 1mm as
illustrated. Then, there shall be found no remarkable abnormality on the capacitor terminals.
68 ■ APRIL 2014