W3F11A2218AT3A Datasheet, PDF (2/4 Pages) AVX Corporation – Feedthru 0805/1206 Capacitors

Feedthru 0805/1206 Capacitors
W2F/W3F Series
L
X
S
T
Common Ground
Feedthru Pad
CL
BL
Feedthru Pad
W
BW
DIMENSIONS
0805 MM
(in.)
1206 MM
(in.)
L
2.01 ± 0.20
(0.079 ± 0.008)
3.20 ± 0.20
(0.126 ± 0.008)
W
1.25 ± 0.20
(0.049 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
T
1.14 Max.
(0.045 Max.)
1.27 Max.
(0.050 Max.)
EW
Common Ground
BW
0.46 ± 0.10
(0.018 ±0.004)
0.89 ± 0.10
(0.035 ± 0.004)
BL
0.18 + 0.25 -0.08
(0.007 + 0.010 -0.003)
0.18 + 0.25 -0.08
(0.007 + 0.010 -0.003)
EW
0.25 ± 0.13
(0.010 ± 0.005)
0.38 ± 0.18
(0.015 ± 0.007)
X
1.02 ± 0.10
(0.040 ± 0.004)
1.60 ± 0.10
(0.063 ± 0.004)
S
0.23 ± 0.15
(0.009 ± 0.006)
0.46 ± 0.15
(0.018 ± 0.006)
T
P
P
S
W
C
L
RECOMMENDED SOLDER PAD LAYOUT (TYPICAL DIMENSIONS)
0805 MM
(in.)
1206 MM
(in.)
T
3.45
(0.136)
4.54
(0.179)
P
0.51
(0.020)
0.94
(0.037)
S
0.76
(0.030)
1.02
(0.040)
W
1.27
(0.050)
1.65
(0.065)
L
1.02
(0.040)
1.09
(0.043)
TYPICAL FEEDTHRU CHIP CAP CONNECTION
Feedthru Chip Component Model
Vcc or
Signal In
Vcc or
Signal Out
Physical Layout - A
Ground
Signal In
Ground
The terminals are connected internally side to side.
Left side and right side are connected and front and
back are connected internally.
For Decoupling, the chip is usually surrounded by
four vias, two for Vcc and two for GND.
For Signal Filtering, the in and out lines need to be
separated on the circuit board.
Ground
Physical Layout - B
Ground
Vcc
C
0.46
(0.018)
0.71
(0.028)
Signal Out
Vcc
Ground
2