F1206B0R25FSTR Datasheet, PDF (2/17 Pages) AVX Corporation – Accu-Guard® II SMD Thin-Film Fuse

Accu-Guard^® II
SMD Thin-Film Fuse
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Conditions
Components completely immersed in a
solder bath at 235 ±5°C for 2 secs.
Completely immersed in a solder bath
at 260 ±5°C for 60 secs.
Storage
Shear
Rapid Change of
Temperature
Vibration
Bend
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Components mounted to a substrate.
50 cycles -55°C to +125°C.
Per Mil-Std-202F
Method 201A and
Method 204D Condition D.
Tested as shown in diagram
3 mm�
Deflection
45mm
45mm
Load Life
F0805B, F1206B
25°C, rated current, 20,000 hrs.
Requirement
Terminations to be well tinned
No visible damage
Dissolution of termination
≤ 25% of area
ΔR/R<10%
Good solderability
No visible damage
No visible damage
Δ R/R<10%
No visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%
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