04023J3R9ABSTR Datasheet, PDF (18/20 Pages) AVX Corporation – Thin-Film Technology

Accu-F^® / Accu-P^®
Application Notes
PREHEAT & SOLDERING
CLEANING RECOMMENDATIONS
The rate of preheat in production should not exceed 4°C/
Care should be taken to ensure that the devices are
second and a recommended maximum is about 2°C/second.
thoroughly cleaned of flux residues, especially the space
Temperature differential from preheat to soldering should not
beneath the device. Such residues may otherwise become
exceed 100°C.
conductive and effectively offer a lossy bypass to the device.
For further specific application or process advice, please consult
Various recommended cleaning conditions (which must be
AVX.
optimized for the flux system being used) are as follows:
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
1
COOLING
water and other standard PCB
cleaning liquids.
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
HAND SOLDERING & REWORK
Time . . . . . . . . . . . . . . . 5 minutes max.
Hand soldering is permissible. Preheat of the PCB to 150°C is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260°C.
STORAGE CONDITIONS
Recommended storage conditions for Accu-F^® and
Accu-P^® prior to use are as follows:
Temperature . . . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED SOLDERING
PROFILE
IR REFLOW
220
210
200
190
180
170 Assembly enters the
160 ^{preheat zone}
Additional soak time
to allow uniform
heating of the
substrate
150
140
130
120
110
100
90
80
Soak time
1) Activates the flux
70
2) Allows center of board
temperatures to catch up with
60
corners
50
40
30
20
0
0.5
1
1.5
2
2.5
Time (mins)
45-60 sec.
above solder
melting point
3
3.5
Assembly exits heat–
no forced cooldown
186°C solder melting
temperature
4
4.5
VAPOR PHASE
215°C
200
180
160
140
120
100
80
60
40
20
Preheat
0
Time (minutes)
WAVE SOLDERING
260
240
220
200
100°C
180
160
140
120
100
80
60
40
20
Time (seconds)
3–5 seconds
Natural
Cooling
Enter Wave
0 10 20 30 40 50 60 70 80 90 100 110 120
Transfer from
preheat with
min. delay &
temp. loss
215°C
200
180
160
140
120
100
80
60
40
20
Reflow
Duration varies
with thermal mass
of assembly
10–60 secs typical
Enter
Vapor
Natural
Cooling
0 10 20 30 40 50 60 70
Time (seconds)
23