04023J4R5BBSTR Datasheet, PDF (16/20 Pages) AVX Corporation – Thin-Film RF/Microwave Capacitors

Accu-F^® / Accu-P^®
Environmental / Mechanical Characteristics
ENVIRONMENTAL CHARACTERISTICS
TEST
Life (Endurance)
MIL-STD-202F Method 108A
CONDITIONS
125°C, 2U_R,1000 hours
REQUIREMENT
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
Accelerated Damp
85°C, 85% RH, U_R, 1000 hours
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Heat Steady State
MIL-STD-202F Method 103B
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
Temperature Cycling
MIL-STD-202F Method 107E
MIL-STD-883D Method 1010.7
-55°C to +125°C, 15 cycles – Accu-P^®
-55°C to +125°C, 5 cycles – Accu-F^®
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
Resistance to Solder Heat
IEC-68-2-58
260°C ± 5°C for 10 secs
C remains within initial limits
MECHANICAL CHARACTERISTICS
TEST
Solderability
IEC-68-2-58
Leach Resistance
IEC-68-2-58
Adhesion
MIL-STD-202F Method 211A
Termination Bond Strength
IEC-68-2-21 Amend. 2
Robustness of Termination
IEC-68-2-21 Amend. 2
High Frequency Vibration
MIL-STD-202F Method 201A,
204D (Accu-P^® only)
Storage
CONDITIONS
Components completely immersed in a
solder bath at 235°C for 2 secs.
Components completely immersed in a
solder bath at 260±5°C for 60 secs.
A force of 5N applied for 10 secs.
Tested as shown in diagram
D
D = 3mm Accu-P
D = 1mm Accu-F
45mm
45mm
A force of 5N applied for 10 secs.
55Hz to 2000Hz, 20G
12 months minimum with components
stored in “as received” packaging
REQUIREMENT
Terminations to be well tinned, minimum 95%
coverage
Dissolution of termination faces ≤15% of area
Dissolution of termination edges ≤25% of length
No visible damage
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
No visible damage
No visible damage
Good solderability
QUALITY & RELIABILITY
Accu-P^® is based on well established thin-film technology
and materials.
• ON-LINE PROCESS CONTROL
This program forms an integral part of the production cycle
and acts as a feedback system to regulate and control
production processes. The test procedures, which are
integrated into the production process, were developed
after long research work and are based on the highly
developed semiconductor industry test procedures and
equipment. These measures help AVX to produce a con-
sistent and high yield line of products.
• FINAL QUALITY INSPECTION
Finished parts are tested for standard electrical parameters
and visual/mechanical characteristics. Each production lot
is 100% evaluated for: capacitance and proof voltage at
2.5 U_R. In addition, production is periodically evaluated for:
Average capacitance with histogram printout for
capacitance distribution;
IR and Breakdown Voltage distribution;
Temperature Coefficient;
Solderability;
Dimensional, mechanical and temperature stability.
QUALITY ASSURANCE
The reliability of these thin-film chip capacitors has been
studied intensively for several years. Various measures
have been taken to obtain the high reliability required today
by the industry. Quality assurance policy is based on well
established international industry standards. The reliability
of the capacitors is determined by accelerated testing
under the following conditions:
Life (Endurance)
Accelerated Damp
125°C, 2U_R, 1000 hours
Heat Steady State
85°C, 85% RH, U_R,
1000 hours.
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