F1206A0R20FSTR Datasheet, PDF (15/23 Pages) AVX Corporation – Accu-Guard, SMD Thin-Film Fuse

Accu-Guard^®
SMD Thin-Film Fuse
QUALITY & RELIABILITY
Accu-Guard^® series of fuses is based on established
thin-film technology and materials used in the semiconduc-
tor industry.
• In-line Process Control: This program forms an integral
part of the production cycle and acts as a feedback sys-
tem to regulate and control production processes. The
test procedures, which are integrated into the production
process, were developed after long research and are
based on the highly developed semiconductor industry
test procedures and equipment. These measures help
AVX/Kyocera to produce a consistent and high yield line
of products.
• Final Quality Inspection: Finished parts are tested for
standard electrical parameters and visual/mechanical
characteristics. Each production lot is 100% evaluated for
electrical resistance. In addition, each production lot is
evaluated on a sample basis for:
• Insulation resistance (post fusing)
• Blow time for 2 x rated current
• Endurance test: 125°C, rated current, 4 hours
HANDLING AND SOLDERING
SMD chips should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use
of plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are
minimized. For automatic equipment, taped and reeled
product is the ideal medium for direct presentation to the
placement machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used
(e.g. FR-4, G-10).
For other circuit board materials, please consult factory.
WAVE SOLDERING
Dimensions: millimeters (inches)
0402 0.8
(0.031)
2.1
(0.083) 0.5
(0.020)
0.8
(0.031)
0.59
(0.023)
0603
1.25
(0.049)
3.1
(0.122)
0.6
(0.024)
1.25
(0.049)
0805
1.5
(0.059)
4.0
(0.157)
1.0
(0.039)
1206
1.5
(0.059)
5.0
(0.197)
2.0
(0.079)
0.8
(0.031)
1.5
(0.059)
1.25
(0.049)
0612
1.25
(0.049)
3.1
(0.122)
0.6 (0.024)
1.25
(0.049)
1.5
(0.059)
3.1
(0.122)
28
1.6
(0.063)
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs are:
a. Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but
it is not advisable to go below this.
b. Pad overlap 0.5mm.
c. Pad extension 0.5mm for reflow. Pad extension about
1.0mm for wave soldering.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should
not exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should
be used.
REFLOW SOLDERING
Dimensions: millimeters (inches)
0402
0.6
(0.024)
1.7
(0.068) ^0.5
(0.020)
0.6
(0.024)
0.59
(0.023)
1206
1.0
(0.039)
4.0
(0.157)
2.0
(0.079)
0603
0.85
(0.033)
2.3
(0.091)
0.6
(0.024)
0.85
(0.033)
0805 _1.0
(0.039)
3.0
(0.118)
1.0
(0.039)
0.8
(0.031)
1.0
(0.039)
1.25
(0.049)
0612
0.85
(0.033)
2.3
(0.091)
0.6 (0.024)
0.85
(0.033)
3.1
(0.122)
1.0
(0.039)
1.6
(0.063)