MG042S05X150 Datasheet, PDF (1/4 Pages) AVX Corporation – AVX Multilayer Ceramic Transient Voltage Suppression

MultiGuard (2&4 Elements)
AVX Multilayer Ceramic Transient Voltage Suppression
Arrays – ESD Protection for CMOS and Bi Polar Systems
GENERAL DESCRIPTION AND COMMENTS
AVX’s Transient Voltage Suppression (TVS) Arrays address ESD protection of I/O lines in portable equipment and pro-
six trends in today’s electronic circuits: (1) mandatory ESD gramming ports in cellular phones. Other applications
protection, (2) mandatory EMI control, (3) signal integrity include differential data line protection, ASIC protection and
improvement, (4) PCB downsizing, (5) reduced component LCD driver protection for portable computing devices.
placement costs, and (6) protection from induced slow
speed transient voltages and currents.
Where multiple lines require the ESD protection, the 4-element
0612 or 0508 chip is an ideal solution. While the 2-element
AVX’s MultiGuard products offer numerous advantages, 0405 MultiGuard is the smallest TVS array, the 4-element
which include a faster turn-on-time (<1nS), repetitive strike 0508 MultiGuard is the smallest 4-element TVS device avail-
capability, and space savings. In some cases, MultiGuard able in the market today.
consumes less than 75% of the PCB real estate required for
the equivalent number of discrete chips. This size advantage,
coupled with the savings associated with placing only one
chip, makes MultiGuard the TVS component of choice for
Available with standard working voltage of 5.6V up to 18V
with low capacitance in the 3 case sizes, AVX MultiGuard
arrays offer a very broad range of integrated TVS solutions
to the design community.
SIZE: 0405
SIZE: 0508
SIZE: 0508
SIZE: 0612
2 Element
ELECTRICAL CHARACTERISTICS PER ELEMENT
4 Element
AVX
Part Number
Working Working Breakdown Clamping Test Maximum Transient
Voltage Voltage Voltage Voltage Current Leakage Energy
(DC)
(AC)
For VC Current Rating
Peak
Current
Rating
Typical
Cap
MG042S05X150 _ _ 5.6
4.0
8.5±20%
18
1
2 Element
0405 Chip
MG042L14V400 _ _
14.0
10.0 18.5±12%
32
1
MG042L18V500 _ _ 18.0
14.0
N/A
50
1
35
0.05
15
300
15
0.02
15
45
10
0.02
15
40
MG052S05A150 _ _ 5.6
4.0
8.5±20%
18
1
35
0.10
30
825
MG052S09A200 _ _ 9.0
6.4 12.7±15%
22
1
25
0.10
30
550
2 Element
0508 Chip
MG052S14A300 _ _
14.0
10.0 19.5±12%
32
1
15
0.10
30
425
MG052S18A400 _ _ 18.0
14.0 25.5±10%
42
1
10
0.10
30
225
MG052L18X500 _ _ ≤18.0 ≤14.0
N/A
50
1
10
0.10
20
50
MG054S05X150 _ _ 5.6
4.0
8.5±20%
18
1
35
0.05
15
400
MG054S09X200 _ _ 9.0
6.4 12.7±15%
22
1
25
0.05
15
300
4 Element
0508 Chip
MG054S14X300 _ _
14.0
10.0 19.5±12%
32
1
15
0.05
15
150
MG054S18X400 _ _ 18.0
14.0 25.5±10%
42
1
10
0.05
15
120
MG054L18V500 _ _ ≤18.0 ≤14.0
N/A
50
1
10
0.02
15
50
MG064S05A150 _ _ 5.6
4.0
MG064S09A200 _ _ 9.0
6.4
4 Element
0612 Chip
MG064S14A300 _ _
14.0
10.0
MG064S18A400 _ _ 18.0
14.0
MG064L18X500 _ _ ≤18.0 ≤14.0
Termination Finish Code
Packaging Code
8.5±20%
18
1
12.7±15%
22
1
19.5±12%
32
1
25.5±10%
42
1
N/A
50
1
V_W (DC)
V_W (AC)
V_B
V_B Tol
DC Working Voltage (V)
AC Working Voltage (V)
Typical Breakdown Voltage
(V @ 1mA_DC )
V_B Tolerance is ± from Typical Value
35
0.10
30
825
25
0.10
30
550
15
0.10
30
425
10
0.05
15
120
10
0.10
20
75
V_C
Clamping Voltage (V @ I_VC )
I_VC
Test Current for V_C (A, 8x20µS)
I_L
Maximum Leakage Current at the Working Voltage (µA)
E_T
Transient Energy Rating (J, 10x1000µS)
I_P
Peak Current Rating (A, 8x20µS)
Cap Typical Capacitance (pF) @ 1MHz and 0.5 VRMS
21