F0402G Datasheet, PDF (1/4 Pages) AVX Corporation – Accu-Guard II Low Current

Accu-Guard^® II Low Current
Miniature 0402 Size Thin-Film Fuses
The new F0402G Accu-Guard® series of fuses is based on
thin-film technology which allows precise control of the
component electrical and physical characteristics that is not
possible with standard fuse technologies. The Accu-Guard
Low Current series encompasses the lowest current ratings
in a compact 0402 package and features LGA terminations.
ELECTRICAL SPECIFICATIONS
Operating temperature: -55ºC to +125ºC
Current carrying capacity:
-55ºC to -11ºC 107% of rating
-10ºC to +60ºC 100% of rating
+61ºC to +100°C 85% of rating
+101ºC to +125°C 80% of rating
Rated voltage: 32V
Post-fusing resistance: >1MΩ
RECOMMEND PAD LAYOUT
millimeters (inches)
0.31 (0.012)
0.55
(0.022)
1.15 (0.045)
Part Number
F0402G0R05FNTR
F0402G0R06FNTR
F0402G0R07FNTR
F0402G0R10FNTR
F0402G0R12FNTR
F0402G0R15FNTR
F0402G0R20FNTR
Current
Rating
A
0.050
0.062
0.075
0.100
0.125
0.150
0.200
Resistance
@0.1 x I_RATED
Ω (max.)
3.4
2.5
2.0
2.4
1.6
1.2
0.8
Voltage Drop
@I_RATED
mV (max.)
250
280
280
300
250
220
210
Fusing Current
(within 5 sec)
A
0.125
0.155
0.1875
0.250
0.312
0.375
0.500
Pre-Arc I²t
@10xI_RATED
A²-sec (typ)
2 x 10^-6
2 x 10^-6
4 x 10^-6
7 x 10^-6
1 x 10^-5
2 x 10^-5
4 x 10^-5
Color
Code
Blue
Yellow
Brown
Red
White
Green
Pink
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Storage
Shear
Temperature
Cycling
Bend
Conditions
Components completely immersed in a
solder bath at 245 ±5°C for 3 secs.
Components completely immersed in a solder
bath at 255 ±5°C for 60 secs.
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
Increasing shearing force applied paralled to
the sufstrate till destruction.
Components mounted to a flexible substrate
(e.g. FR – 4). 1000 cycles -55ºC to +125ºC.
Tested as shown in diagram
3 mm�
Deflection
45mm
45mm
Requirement
Total area of imperfections in solder coating
up to 5% of the land suface area
Dissolution of termination
≤ 15% of the land surface area
Good solderability
Destruction at 5N force minimum
No Visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%