04023J7R5BBSTR Datasheet, PDF (1/20 Pages) AVX Corporation – Thin-Film Technology

Accu-F^® / Accu-P^®
Thin-Film Technology
THE IDEAL CAPACITOR
The non-ideal characteristics of a real capacitor can be
ignored at low frequencies. Physical size imparts inductance
to the capacitor and dielectric and metal electrodes result in
This accuracy sets apart these Thin-Film capacitors from
ceramic capacitors so that the term Accu has been
employed as the designation for this series of devices, an
abbreviation for “accurate.”
resistive losses, but these often are of negligible effect on the
circuit. At the very high frequencies of radio communication _{THIN-FILM TECHNOLOGY}
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(>100MHz) and satellite systems (>1GHz), these effects
become important. Recognizing that a real capacitor will
Thin-film technology is commonly used in producing semi-
exhibit inductive and resistive impedances in addition to
conductor devices. In the last two decades, this technology
capacitance, the ideal capacitor for these high frequencies is
has developed tremendously, both in performance and in
an ultra low loss component which can be fully characterized
process control. Today’s techniques enable line definitions of
in all parameters with total repeatability from unit to unit.
below 1μm, and the controlling of thickness of layers at 100Å
(10^-2μm). Applying this technology to the manufacture of
Until recently, most high frequency/microwave capacitors
capacitors has enabled the development of components
were based on fired-ceramic (porcelain) technology. Layers
where both electrical and physical properties can be tightly
of ceramic dielectric material and metal alloy electrode paste
controlled.
are interleaved and then sintered in a high temperature oven.
This technology exhibits component variability in dielectric
The thin-film production facilities at AVX consist of:
quality (losses, dielectric constant and insulation resistance),
• Class 1000 clean rooms, with working areas under
variability in electrode conductivity and variability in physical
laminar-flow hoods of class 100, (below 100 particles
size (affecting inductance). An alternate thin-film technology
per cubic foot larger than 0.5μm).
has been developed which virtually eliminates these vari-
• High vacuum metal deposition systems for high-purity
ances. It is this technology which has been fully incorporated
electrode construction.
into Accu-F^® and Accu-P^® to provide high frequency capaci-
tors exhibiting truly ideal characteristics.
• Photolithography equipment for line definition down to
2.0μm accuracy.
The main features of Accu-F^® and Accu-P^® may be summa-
rized as follows:
• Plasma-enhanced CVD for various dielectric deposi-
tions (CVD=Chemical Vapor Deposition).
• High purity of electrodes for very low and repeatable
ESR.
• High accuracy, microprocessor-controlled dicing saws
for chip separation.
• Highly pure, low-K dielectric for high breakdown field,
high insulation resistance and low losses to frequencies
above 40GHz.
• High speed, high accuracy sorting to ensure strict
tolerance adherence.
• Very tight dimensional control for uniform inductance,
unit to unit.
• Very tight capacitance tolerances for high frequency
signal applications.
TERMINATION
ALUMINA
ELECTRODE ^SEAL
ELECTRODE
DIELECTRIC
ALUMINA
ACCU-P^® CAPACITOR
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