HLMP-HG70 Datasheet, PDF (9/13 Pages) AVAGO TECHNOLOGIES LIMITED – 5mm Standard Oval Red and Amber LEDs

HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Avago Technologies LED Configuration
Avago Technologies LED Configuration
 The recommended PC board plated through holes (PTH)
size for LED component leads follows.
LED component lead
size
Diagonal
Plated through hole
diameter
0.45 mm × 0.45 mm 0.636 mm
(0.018 in. × 0.018 in.) (0.025 in.)
0.98 mm to 1.08 mm
(0.039 in. to 0.043 in.)
Anode
0.50 mm × 0.50 mm 0.707 mm
1.05 mm to 1.15 mm
(0.020 in. × 0.020 in.) (0.028 in.)
(0.041 in. to 0.045 in.)
NOTE Electrical connection between the bottom
surface of the LED die and the lead frame is
achieved through conductive paste.
 Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on the LED. Non- metal material is
recommended because it will absorb less heat during the
wave soldering process.
NOTE
To further assist the customer in designing he
jig accurately that fits the Avago
Technologies’ product, a 3D model of the
product is available upon request.
 At elevated temperatures, the LED is more susceptible to
mechanical stress. Therefore, the PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of the alignment fixture or pallet.
 If the PCB board contains both through hole (TH) LEDs and
other surface mount components, it is recommended that
surface mount components be soldered on the top side of
the PCB. If surface mount must be on the bottom side,
these components should be soldered using reflow
soldering prior to insertion of the TH LED.
 Over-sizing the PTH can lead to a twisted LED after
clinching. On the other hand, under-sizing the PTH can
cause difficulty when inserting the TH LED.
Application Precautions
1. The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated in
the data sheet. Constant current driving is recommended
to ensure consistent performance.
2. LEDs exhibit slightly different characteristics at different
drive currents that might result in larger performance
variation (i.e., intensity, wavelength, and forward voltage).
The user is recommended to set the application current as
close as possible to the test current to minimize these
variations.
3. The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When driving
the LED in matrix form, it is crucial to ensure that the
reverse bias voltage does not exceed the allowable limit of
the LED.
Avago Technologies
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