AMMC-5024 Datasheet, PDF (9/10 Pages) AVAGO TECHNOLOGIES LIMITED – 30 KHz-40GHz Traveling Wave Amplifier

The chip is 100 µm thick and should be handled with
care.
This MMIC has exposed air bridges on the top surface.
Handle at edges or with a custom collet (do not pick up
die with vacuum on die center.)
This MMIC is also static sensitive and ESD handling precau-
tions should be taken.
For more detailed information, see Avago Application
Note 54“GaAs MMIC ESD, Die Attach and Bonding Guide-
lines.”
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St.Paul, MN, 800-262-
3824
Drain Bias
(Vdd)
Vdd AUX
RF_Input
GND
Nine Identical
Second Gate
First Gate
Bias (Vg1)
Figure 19. AMMC-5024 Schematic.
Vdd_AUX _Vdd
DET_Reference
DET_Bias
DET_Output GND
0 165 415550 830
1270
2260
1050
960
RF Output
Vg2
485
RF INPUT
235
0
90
733
90
V_{g1 2080 2350} ^GND
2250
Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)
DET_OUT
RF_Output
DET_BIAS
DET_REF