HSMC-C130 Datasheet, PDF (8/8 Pages) AVAGO TECHNOLOGIES LIMITED – Surface Mount ChipLEDs

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START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
Figure 12. Tape leader and trailer dimensions
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Reflow Soldering:
For more information on reflow soldering, refer to Ap-
plication Note AN-1060, Surface Mounting SMT LED
Indicator Components.
Storage Condition:
5 to 30°C @ 60%RH max.
Baking is required before mounting, if:
1. Humidity Indicator Card is > 10% when read at 23 ±
5°C.
2. Device expose to factory conditions <30°C/60%RH
more than 168 hours.
Recommended baking condition:
60±5°C for 20 hours.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0484EN - November 23, 2010