HSDL-9100_09 Datasheet, PDF (8/13 Pages) AVAGO TECHNOLOGIES LIMITED – Surface-Mount Proximity Sensor

HSDL-9100 Moisture Proof Packaging
All HSDL-9100 options are shipped in moisture proof
package. Once opened, moisture absorption begins.
This part is compliant to JEDEC Level 3.
Baking Conditions Chart
Baking Conditions
If the parts are not stored in dry conditions, they must
be baked before reflow to prevent damage to the parts.
Package
In reels
In bulk
Temp
60 °C
100 °C
125 °C
Time
t 48hours
t 4hours
t 2 hours
Baking should only be done once.
Recommended Storage Conditions
Units in A Sealed
Moisture-Proof
Package
Package Is
Opened (Unsealed)
Environment
less than 30 deg C,
and less than
60% RH
Yes
Storage Temperature
Relative Humidity
10°C to 30°C
below 60% RH
No Baking
Yes
Is Necessary
Package Is
Opened less
Than 168 hours
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within seven days if stored at the recommended storage
conditions.
No
No
Perform Recommended
Baking Conditions
Figure 7. Baking conditions chart
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