HLMP-ED80 Datasheet, PDF (6/9 Pages) AVAGO TECHNOLOGIES LIMITED – Radiometrically Tested AlInGaP II LED Lamps for Sensor-Based Applications

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LEDpackage.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LEDcomponent may be effectively hand soldered to
PCB. However, it is only recommended under unavoid-
able circumstances such as rework. The closest manual
soldering distance of the soldering heat source (sol-
dering iron’s tip) to the body is 1.59mm. Soldering the
LED using soldering iron tip closer than 1.59mm might
damage the LED.
1.59mm
• ESDprecaution must be properly applied on the sol-
dering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer to
Avago application note AN 1142 for details. The solder-
ing iron used should have grounded tip to ensure elec-
trostatic charge is properly grounded.
• Recommended soldering condition:
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
Wave
Soldering ^{[1, 2]}
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and main-
tained according to the recommended temperature
and dwell time. Customer is advised to perform daily
check on the soldering profile to ensure that it is always
conforming to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Avago Technologies LED configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
CATHODE
AlInGaP Device
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should not
apply weight or force on LED. Non metal material is rec-
ommended as it will absorb less heat during wave sol-
dering process.
• At elevated temperature, LEDis more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which in-
cludes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
Plated through
hole diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after clinch-
ing. On the other hand under sizing the PTH can cause
difficulty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.