HCNR200-300 Datasheet, PDF (5/19 Pages) AVAGO TECHNOLOGIES LIMITED – High-Linearity Analog Optocouplers

Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
PEAK
TEMP.
245 °C
200
160 °C
150 °C
140 °C
100
ROOM
TEMPERATURE
0
0
2.5 C ± 0.5 °C/SEC.
30
SEC.
30
3 °C + 1 °C/–0.5 °C
SEC.
PREHEATING TIME
150 °C, 90 + 30 SEC.
50
100
150
TIME (SECONDS)
PEAK
TEMP.
240 °C
SOLDERING
TIME
200 °C
PEAK
TEMP.
230 °C
50 SEC.
200
TIGHT
TYPICAL
LOOSE
250
NOTE: NON-HALIDE FLUX SHOULD BE USED.
Recommended Pb-Free IR Profile
t_p
T_p
T_L ^{217 °C}
* 245 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
T_smax
150 - 200 °C
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE
15 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
Regulatory Information
The HCNR200/201 optocoupler features a 0.400” wide, eight pin DIP package. This package was specifically designed
to meet worldwide regulatory requirements. The HCNR200/201 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, FILE E55361
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 050 only)
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