AMMC-3040 Datasheet, PDF (5/6 Pages) Agilent(Hewlett-Packard) – 18-36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier

0 82
420
700
914
1141
1475
2018
760
Vd1
Vg2
Vd2
Vd3
Vd4
IF
2520
760
480
LO
96
0
Vg1
Vg2
Vg3
Vg4
0 98
568
894
1320
Figure 15. AMMC-3040 Bond pad locations, dimensions in microns
IF
2018
300
RF
1720
To V_DD DC Drain
Supply Feed
Gold Plated Shim
(optional)
100 pF
Cb
LO
IF
0.6 pF
~500 µm long
wire
To V_DD DC Drain
Supply Feed
Gold Plated Shim
(optional)
100 pF
Cb
LO
RF
IF
0.6 pF
~500 µm long
wire
RF
100 pF
Cb
To V_GG DC Gate
Supply Feed
To V_GG DC Gate
Supply Feed
100 pF
Cb
100 pF
Cb
To V_GG DC Gate
Supply Feed
(a) Fundamental LO. Single drain and single gate supply assembly
for using the LO amplifier in fundamental frequency mixer applications.
(b) Sub-harmonic LO. Separate first-stage gate bias supply to use
the LO amplifier as a multiplier for application as a sub-harmonic mixer.
Figure 16. AMMC-3040 assembly diagram
(Note: To assure stable operation bias supply feeds should be bypassed to ground with a capacitor, Cb ≥ 100 pF typical.)
Biasing for Fundamental Mixing
The recommended DC bias condition for the AMMC-
3040 LO amplifier when used as a fundamental frequen-
cy mixer is with all four drains connected to a single 3.5
to 4.5 V supply and all four gates connected to an adjust-
able negative supply voltage as shown in Figure 16(a).
The gate voltage is adjusted for a total drain supply cur-
rent of typically 150 to 250 mA.
The second, third, and fourth stage DC drain bias lines
are connected internally and therefore require only a
single bond wire. A separate bond wire is needed for the
first stage DC drain bias, V_d1.
The third and fourth stage DC gate bias lines are con-
nected internally. A total of three DC gate bond wires are
required: one for V_g1, one for V_g2, and one for the V_g3/V_g4
connection. The internal matching circuitry at the RF in-
put creates a 50-ohm DC and RF path to ground. Any
DC voltage applied to the RF input must be maintained
below 1 volt, otherwise, a blocking capacitor should be
used. The RF output is AC coupled.
No ground bond wires are needed since the ground con-
nection is made by means of plated through via holes to
the backside of the chip.