HCPL-817 Datasheet, PDF (4/7 Pages) Agilent(Hewlett-Packard) – Phototransistor Optocoupler High Density Mounting Type

HCPL-817-300E
4.6 ± 0.5
(0.181)
7.62 ± 0.3
(0.3)
LEAD FREE
ANODE
A 817
Y WW
DATE CODE
6.5 ± 0.5
(0.256)
1.2 ± 0.1
(0.047)
RANK
3.5 ± 0.5
(0.138)
2.54 ± 0.25
(0.1)
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
10.16 ± 0.3
(0.4)
0.26
(0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES)
Solder Reflow Temperature Profile
250°C
217°C
200°C
30 seconds
260°C (Peak Temperature)
150°C
60 sec
25°C
60 ~ 150 sec
Note: Non-halide flux should be used.
90 sec
Time (sec)
60 sec
1) One-time soldering reflow is recommended
within the condition of temperature andtime
profile shown.
2) When using another soldering method such
as infrared ray lamp, the temperature may
rise partially in the mold of thedevice. Keep
the temperature on the package of the device
within the condition of (1) above.
Absolute Maximum Ratings (T_A = 25˚C)
Storage Temperature, T_S
Operating Temperature, T_A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I_F
Reverse Input Voltage, V_R
Input Power Dissipation, P_I
Collector Current, I_C
Collector-Emitter Voltage, V_CEO
Emitter-Collector Voltage, V_ECO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, V_iso (AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +125˚C
–30˚C to +100˚C
260˚C for 10 s
50 mA
6V
70 mW
50 mA
70 V
6V
150 mW
200 mW
5000 Vrms