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HCPL-7520-300 Datasheet, PDF (4/16 Pages) AVAGO TECHNOLOGIES LIMITED – Isolated Linear Sensing IC | |||
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3ËC + 1ËC/â0.5ËC/SEC.
REFLOW HEATING RATE 2.5ËC ± 0.5ËC/SEC.
PEAK
TEMP.
245ËC
200
160ËC
150ËC
140ËC
100
2.5ËC ± 0.5ËC/SEC.
3ËC + 1ËC/â0.5ËC
PREHEATING TIME
150ËC, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240ËC
SOLDERING
TIME
200ËC
PEAK
TEMP.
230ËC
50 SEC.
TIGHT
TYPICAL
LOOSE
0
0
50
100
150
200
250
ROOM TEMPERATURE
TIME (SECONDS)
Note: Use of non-chlorine-activated fluxes is highly recommended.
Recommended Pb-Free IR Profile
tp
Tp
TL
Tsmax
Tsmin
260 +0/-5 ËC
217 ËC
RAMP-UP
3 ËC/SEC. MAX.
150 - 200 ËC
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 ËC of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 ËC/SEC. MAX.
60 to 150 SEC.
25
t 25 ËC to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25 ËC to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 ËC, Tsmin = 150 ËC
Note: Use of non-chlorine-activated fluxes is highly recommended.
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