HCPL-7510-560 Datasheet, PDF (4/17 Pages) –

Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
30
TIME
SEC.
200°C
30
SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
0
0
50
100
150
200
250
ROOM TEMPERATURE
TIME (SECONDS)
Note: Use of non-chlorine-activated fluxes is highly recommended.
Recommended Pb-Free IR Profile
t_p
T_p
TL ^217°C
260 +0/-5°C
RAMP-UP
3°C/SEC. MAX.
Tsmax ^{150 - 200°C}
Tsmin
ts
PREHEAT
t_L
60 to 180 SEC.
TIME WITHIN 5°C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6°C/SEC. MAX.
60 to 150 SEC.
25
t 25°C to PEAK
TIME (SECONDS)
Notes:
the time from 25°C to peak temperature = 8 minutes max.
Tsmax = 200°C, tsmin = 150°C
Note: Use of non-chlorine-activated fluxes is highly recommended.