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ACPL-4800-000E Datasheet, PDF (4/10 Pages) AVAGO TECHNOLOGIES LIMITED – High CMR Intelligent Power Module and Gate Drive Interface Optocoupler | |||
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Solder Reflow Temperature Profile (Gull Wing Surface Mount Option 300 Parts)
300
PREHEATING RATE 3ËC + 1ËC/-0.5ËC/SEC.
REFLOW HEATING RATE 2.5ËC ± 0.5ËC/SEC.
PEAK
TEMP.
245ËC
200
160ËC
150ËC
140ËC
100
2.5ËC ± 0.5ËC/SEC.
3ËC + 1ËC/-0.5ËC
PREHEATING TIME
150ËC, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240¡C
SOLDERING
TIME
200ËC
PEAK
TEMP.
230ËC
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used
Recommended Pb-Free IR Profile
tp
Tp
TL
T smax
T smin
217ËC
150 - 200
260 +0/-5ËC
RAMP-UP
3ËC/SEC. MAX.
ËC
ts
tL
PREHEAT
60 to 180 SEC.
TIME WITHIN 5ËC of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6ËC/SEC. MAX.
60 to 150 SEC.
25
t 25ËC to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200ËC, Tsmin = 150ËC
Note: Non-halide flux should be used
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