HSMM-C110 Datasheet, PDF (3/9 Pages) AVAGO TECHNOLOGIES LIMITED – High brightness

Package Dimensions, continued
CATHODE
MARK
1.6 (0.063)
3.2 (0.126 )
DIFFUSED
EPOXY
0.6 (0.024)
2.0 (0.079)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
POLARITY
1.1 (0.043)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
CATHODE
MARK
1.6
(0.063 )
0.8 (0.031)
0.3 (0.012)
DIFFUSED EPOXY
1.0
(0.039)
POLARITY
PC BOARD
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C150
NOTES:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
SOLDERING
TERMINAL
HSMx-C191
Absolute Maximum Ratings at T_A = 25˚C
Parameter
DC Forward Current ^[1]
HSMM-C110/C120/C170/C190/C150
HSMN-C110/C120/C170/C190/C191/C150
20
Power Dissipation
78
Reverse Voltage (I_R = 100 μA)
5
Led Junction Temperature
95
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
–40 to +85
–40 to +85
See reflow soldering profile (Figure 7)
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at T_A = 25˚C
Forward Voltage
Part Number
V_F (Volts)
@ I_F = 20 mA
Typ.
Max.
HSMM-C110/C150
3.3
3.9
HSMN-C110/C150
3.3
3.9
HSMM-C120
3.3
3.9
HSMN-C120
3.3
3.9
HSMM-C170/C190
3.3
3.9
HSMN-C170/C190/C191 3.3
3.9
V_F Tolerance: ±0.1 V.
Reverse Breakdown
V_R (Volts)
@ I_R = 100 μA
Min.
5
5
5
5
5
5
Capacitance C
(pF), V_F = 0,
f = 1 MHz
Typ.
70
70
45
45
70
70
3
Units
mA
mW
V
˚C
˚C
˚C
Thermal
Resistance
RT_J–PIN (˚C/W)
Typ.
450
450
450
450
300
300