HFBR-0501 Datasheet, PDF (3/19 Pages) Agilent(Hewlett-Packard) – Versatile Link The Versatile Fiber Optic Connection

Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link
components, the optical port plug should be left in to
prevent contamination of the port. Do not use reflow
solder processes (i.e., infrared reflow or vapor-phase
reflow). Nonhalogenated water soluble fluxes
(i.e., 0% chloride), not rosin based fluxes, are recom-
mended for use with Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period
of time, they may require a baking step before the
soldering process. Refer to the special labeling on the
shipping tube for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane, Other: soap solution, naphtha.
CAUTION
This bag contains
MOISTURE-SENSITIVE
DEVICES
Level
4
1. Shelf life in sealed bag: 12 months at < 40°C and < 90% Relative
Humidity (RH).
2. After this bag is opened, devices that will be subjected to wave
soldering, or equivalent processing (solder temperature < 260°C for
10 sec) must be:
a) Mounted within 72 hours at factory conditions of ≤ 30°C/60% RH.
b) Stored at ≤ 20% RH.
3. Devices require baking, before mounting, if:
a) Desiccant changes to PINK.
b) If 2a or 2b are not met.
4. If baking is required, devices may be baked outside of tube for 20
hours at 75°C.
Bag Seal Date: ______________________________________________________
(If blank, see barcode label)
Note: LEVEL defined by EIA JEDEC Standard J-STD-020
Do not use partially halogenated hydrocarbons such as
1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.0
(0.080)
0.64
(0.025)
18.8
(0.740)
6.8
(0.270)
7₇.7_.61
(0(0.3.3005))
10.2
(0.400)
5.1
(0.200)
4.2
(0.165)
7.62
(0.300)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
0.51
(0.020)
0.64 (0.025) DIA.
1.27
(0.050)
2.5
(0.100)
2.8
(0.109)
1.85
(0.073)
3
18.8
0.740
7.6
(0.30)