HCPL-181-000E Datasheet, PDF (3/6 Pages) AVAGO TECHNOLOGIES LIMITED – Phototransistor Optocoupler SMD Mini-Flat Type

Package Outline Drawings
HCPL-181-000E
2.54
± 0.25
181
Y WW
LEAD
FREE
DATE CODE
4.40 ± 0.2
RANK
DIMENSIONS IN MILLIMETERS.
HCPL-181-060E
2.54
± 0.25
3.70 ± 0.45
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
5.30 ± 0.3
7.00
+ 0.2
– 0.7
0.2 ± 0.05
181 V
DATE CODE
Y WW
4.40 ± 0.2
LEAD
FREE
RANK
DIMENSIONS IN MILLIMETERS.
3.70 ± 0.45
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within the
condition of temperature and time profile shown at right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package of
150° C
the device within the condition of (1) above.
5.30 ± 0.3
7.00
+ 0.2
– 0.7
0.2 ± 0.05
250° C
217° C
200° C
30 seconds
260° C (Peak Temperature)
60 sec
25° C
60 ~ 150 sec
90 sec
Time (sec)
Note: Non-halide flux should be used.
60 sec
3