HDSP-2131 Datasheet, PDF (2/16 Pages) Agilent(Hewlett-Packard) – Eight Character 5.0 mm (0.2 inch) Glass/Ceramic Intelligent 5 X 7 Alphanumeric Displays for Military Applications

Package Dimensions
(02.1.6075)TYP.
42.72 (1.68)
(05.2.3130)TYP.
9.91
(0.39) _4.96
(0.195)
PIN 17
2.85
(0.112)
(60..1204)REF.
(00.0.3185)TYP.
4.83
(0.190)
7.62
(0.300)
(06.2.3550)MAX.
SEATING
PLANE
PIN #1
IDENTIFIER
HDSP-XXXX YYWW X Z
PART NUMBER
DATE CODE
LIGHT INTENSITY CATEGORY
COLOR BIN (NOTE 3)
(01.0.7780)TYP.
6.00
(0.24)
(02.0.2990)TYP.
(02.1.5040)TYP.
NON-ACCUM.
12.70
(0.50)
HDSP-213X/2179
(01.0.2570)TYP.
(00.0.5210)TYP.
NOTES:
1. ALL DIMENSIONS ARE IN mm (INCHES).
2. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ± 0.30 mm (0.015 INCH).
3. FOR GREEN AND YELLOW DEVICES ONLY.
4. LEADS ARE COPPER ALLOY, SOLDER DIPPED.
PIN # FUNCTION
1 CLS
2 CLK
3 WR
4 CE
5 RST
6 RD
7 NO PIN
8 NO PIN
9 NO PIN
10 NO PIN
11 D0
12 D1
13 D2
14 D3
15 NC
16 V_DD
PIN # FUNCTION
17 GND (SUPPLY)
18 GND (LOGIC)
19 D4
20 D5
21 D6
22 D7
23 NO PIN
24 NO PIN
25 NO PIN
26 NO PIN
27 FL
28 A0
29 A1
30 A2
31 A3
32 A4
Absolute Maximum Ratings
Supply Voltage, V_DD to Ground^[1]
Operating Voltage, V_DD to Ground^[2]
Input Voltage, Any Pin to Ground
Free Air Operating Temperature Range, T_A
Storage Temperature, T_S
CMOS IC Junction Temperature, T_J (IC)
Soldering Temperature [1.59 mm (0.063 in.) Below Body]
Solder Dipping
Wave Soldering
ESD Protection @ 1.5 kΩ, 100 pF
-0.3 to 7.0 V
5.5 V
-0.3 to V_DD +0.3 V
-55°C to +85°C
-55°C to +100°C
+150°C
260°C for 5 secs
250°C for 3 secs
V_Z = 4 kV (each pin)
Notes:
1. Maximum voltage is with no LEDs illuminated.
2. 20 dots ON in all locations at full brightness.
ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH THE
HDSP-2131, HDSP-2132, HDSP-2133, AND HDSP-2179.
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