ASDL-3023 Datasheet, PDF (17/25 Pages) AVAGO TECHNOLOGIES LIMITED – IrDA Data Compliant Low Power 4Mbit/s with Remote Control Infrared Transceiver

Recommended Metal solder Stencil Aperture
It is recommended that only a 0.11 mm (0.004 inch) or
a 0.127 mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See the Table 1 below the
drawing for combinations of metal stencil aperture and
metal stencil thickness that should be used. Aperture
opening for shield pad is 2.6 mm x 1.5 mm(for ASDL-
3023-S1) as per land pattern. Compared to 0.127mm
stencil thickness 0.11mm stencil thickness has longer
length in land pattern. It is extended outwardly from
transceiver to capture more solder paste volume.
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging
adjacent pads is 0.2mm.It is recommended that two fidu-
cially crosses be placed at mid length of the pads for unit
alignment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended
j
h
k
l
Figure A3. Solder stencil aperture
Table 1.
Stencil thickness,
t(mm)
0.127mm
Aperture size(mm)
Length,l
1.75+/-0.05
0.11mm
2.4+/-0.05
Width,w
0.55+/-0.05
0.55+/-0.05
Solder Mask
Dimension mm
h
0.2
l
3.0
k
3.85
j
10.1
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