MGA-25203_15 Datasheet, PDF (15/15 Pages) AVAGO TECHNOLOGIES LIMITED – 4.9-5.9GHz 3x3mm WiFi Power Amplifier

Handling and Storage
TP
TL
Tsmax
tp
RAMP UP
tL
CRITICAL ZONE
T_L TO T_P
Tsmin
ts
PREHEAT
RAMP DOWN
25
t 25°C TO PEAK
TIME
Typical SMT Reflow Profile for Maximum Temperature = 260+0/-5°C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (mon to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C/sec max
6 min max
Pb-Free Solder
3°C/sec max
100°C
150°C
60-180 sec
3°C/sec max
217°C
60-150 sec
260 +0/-5°C
10-30 sec
6°C/sec max
8 min max
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Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-1961EN - September 22, 2014