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HSSR-7110-300 Datasheet, PDF (1/11 Pages) AVAGO TECHNOLOGIES LIMITED – 90 V/1.0, Hermetically Sealed, Power MOSFET Optocoupler | |||
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HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E
5962-93140
90 V/1.0 Ω, Hermetically Sealed, Power MOSFET Optocoupler
Data Sheet
Description
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and
SMD 5962-93140 are single channel power MOSFET opto-
couplers, constructed in eight-pin, hermetic, dual-in-line,
ceramic packages. The devices operate exactly like a solid-
state relay.
The products are capable of operation and storage over
the full military temperature range and may be pur-
chased as a standard product (HSSR-7110), with full MIL-
PRF-38534 Class H testing (HSSR-7111 and HSSR- 7112),
with MIL-PRF-38534 Class E testing (Class K with excep-
tions) (HSSR-711E) or from the DLA Standard Microcircuit
Drawing (SMD) 5962-93140. Details of the Class E program
may be found on page 11 of this datasheet.
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
1 NC
IF
IO
8+
+2
VF
-3
7
VO
6
4 NC
5-
CONNECTION B
DC CONNECTION
IO
1 NC
8
+
IF
+2
VO
7
-
VF
-3
6
4 NC
5
TRUTH TABLE
INPUT OUTPUT
H
CLOSED
L
OPEN
Features
ï· Dual Marked with Device Part Number and DLA
Standard Microcircuit Drawing
ï· ac/dc Signal &Power Switching
ï· Compact Solid-State Bidirectional Switch
ï· Manufactured and Tested on a MIL-PRF-38534Certified
Line
ï· QML-38534
ï· MIL-PRF-38534 Class H
ï· Modified Space Level Processing Available (Class E)
ï· Hermetically Sealed 8-Pin Dual In-Line Package
ï· Small Size and Weight
ï· Performance Guaranteed over -55°C to 125°C
ï· Connection A0.8 A, 1.0 Ω
ï· Connection B1.6 A, 0.25 Ω
ï· 1500 Vdc Withstand Test Voltage
ï· High Transient Immunity
ï· 5 Amp Output Surge Current
Applications
ï· Military and Space
ï· High Reliability Systems
ï· Standard 28 Vdc and 48 Vdc Load Driver
ï· Standard 24 Vac Load Driver
ï· Aircraft Controls
ï· ac/dc Electromechanical and Solid State Relay
Replacement
ï· I/O Modules
ï· Harsh Industrial Environments
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
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