HSMR-CL25 Datasheet, PDF (1/6 Pages) AVAGO TECHNOLOGIES LIMITED – 0.25mm Blue Leadframe-Based Surface Mount ChipLED

HSMR-CL25
0.25mm Blue Leadframe-Based Surface Mount ChipLED
Data Sheet
Description
The HSMR-CL25 series of parts is designed with an ultra
small form factor to allow this miniaturization. The HSMR-
CL25 series is the thinnest available top emitting package
in the market with high brightness InGaN die technology.
The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to
survive temperature conditions of -40°C to 85°C despite its
small size.
The target applications are Keypad backlighting, Push
button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,
Office Automation, Industrial and Commercial
automations, Home Market appliances, Networking,
Medical Instruments, and Mobile Computing. This product
is competitively priced, and production is geared towards
short lead times and ample capacity.
Features
• Small size top firing
• Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
• Compatible with IR Reflow
• High brightness using InGaN die technology
• Available in 8mm Tape on 7” (178 mm) Diameter Reels
Advantages
• High package thermal dissipation capability due to the
superior package leadframe design
• Small footprint to overcome space count
• Low thickness to overcome space constrains
• Short lead times and competitive pricing
CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.