HLMP-Y601 Datasheet, PDF (1/3 Pages) AVAGO TECHNOLOGIES LIMITED – The junction temperature of the device determines

HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951
T-1 (3mm) AlInGaP LED Lamps
Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accor-
dance with the latest revision of JEDEC stds. Avago tests
parts at the absolute maximum rated conditions recom-
mended for the device. The actual performance you obtain
from Avago parts depends on the electrical and environ-
mental characteristics of your application but will prob-
ably be better than the performance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship be-
tween ambient temperature and actual junction tempera-
ture is given by the following:
T_J(°C) = T_A(°C) + θ_JAP_AVG
where
T_A = ambient temperature in °C
θ_JA = thermal resistance of junction-to-ambient in °C/Watt
P_AVG = average power dissipated in Watt
The estimated MTBF and failure rate at temperatures lower
than the actual stress temperature can be determined by
using an Arrhenius model for temperature acceleration.
Results of such calculations are shown in the table below
using activation energy of 0.43V.
Table 1. Life Tests
Demonstrated Performance
Colors
Total
Stress Test Conditions Device Hrs
Green/Yellow/Amber/Red/ T_A = +75°C
DeepRed/Red Orange
If = 20mA
84,000
Units
Tested
84
Units
Failed
0
Performance in Time (60% confidence)
MTBF^[1]
Failure Rate
(%/1K Hours)
91700
1.091