HEDS-5500 Datasheet, PDF (1/4 Pages) AVAGO TECHNOLOGIES LIMITED – Motion Sensing Products, Optical Encoder Modules

HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table 1.
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
T_J (°C) = T_A (°C) + θ_JA P_AVG
where
T_A = ambient temperature in °C
θ_JA = thermal resistance of
junction-to-ambient in °C/watt
P_AVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Test Name
High Temperature
Operating Life
Temperature
Humidity
Operating Life
Stress Test
Conditions
V_CC = 5.5 V,
V_A = V_B = 3.5 V
T_A = 100°C
1000 hours
V_CC = 5.5 V
V_A = V_B = 3.5 V
1,000 hours
T_A = 85°C
RH = 85%
Total
Device Hrs.
1,405,000
Units
Tested
1,405
1,495,000
1,495
Total
Failed
2
Point Typical Performance
Failure Rate
MTBF
(% /1K Hours)
702,500
0.142
10
149,500
0.669