HEDL-5500 Datasheet, PDF (1/2 Pages) AVAGO TECHNOLOGIES LIMITED – Motion Sensing Products, Optical Encoder Modules

HEDL-5500, HEDL-5600, HEDL-6500, HEDL-9x00 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data Sheet
Description
Failure Rate Prediction
The following cumulative test results have been obtained
from testing performed at Avago Technologies Malaysia
in accordance with the latest revisions of JEDEC standards
Avago tests parts at the absolute maximum rated condi-
tions recommended for the device. The actual perfor-
mance you obtain from Avago parts depends on the
electrical and environmental characteristics of your appli-
cation but will probably be better than the performance
outlined in Table 1.
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
T_J(°C) = T_A(°C) + θ_JAP_AVG
where T_A = ambient temperature in °C
θ_JA = thermal resistance of junction-to-ambient in °C/Watt
P_AVG = average power dissipated in Watt
The estimated MTTF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature
acceleration. Results of such calculations are shown in
the table below using an activation energy of 0.43eV
(reference MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Test Name
Stress Test Conditions
High Temperature Operating Life Vcc=5.0V, T_A=100°C
Total Device
Hours
30,000
Units
Tested
30
Total
Failed ^[3]
0
Point Typical Performance
Failure Rate
MTTF
(% /1 K Hours)
32,700
3.06