ASSR-322R Datasheet, PDF (1/12 Pages) AVAGO TECHNOLOGIES LIMITED – Compact Solid-State Bi-directional Signal Switch

ASSR-322R
Low C x R, Form A, Solid State Relay (250V/8.5/60pF)
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The ASSR-322R is specifically designed for fast switching
applications, commonly found in the test and measure-
ment systems. The low C x R and low output off-state
leakage current provide higher system throughput and
reduce system errors.
The dual channel configuration of ASSR-322R is equiva-
lent to 2 Form A Electromechanical Relays (EMR). One
channel of the relay consists of an AlGaAs infrared light-
emitting diode (LED) input stage optically coupled to
a high-voltage output detector circuit. The detector
consists of a high-speed photovoltaic diode array and
driver circuitry to switch on/off two discrete high volt-
age MOSFETs. The relay turns on (contact closes) with a
minimum input current of 3mA through the input LED.
The relay turns off (contact opens) with an input voltage
of 0.8V or less.
ASSR-322R is available in 8-pin DIP and Gull Wing Surface
Mount packages. Their electrical and switching character-
istics are specified over the temperature range of -40°C
to +85°C.
Features
 Compact Solid-State Bi-directional Signal Switch
 Dual Channel Normally-off Single-Pole-Single-Throw
(SPST) Relay
 250V Output Withstand Voltage
 0.2A Current Rating
 Low Input Current: CMOS Compatibility
 Low C x R: 340pF typical
 Low Output Off-state Leakage Current: 30pA typical
 Fast Speed Switching: 0.2ms (Ton), 0.02ms (Toff )
typical
 High Transient Immunity: >1kV/s
 High Input-to-Output Insulation Voltage
(Safety and Regulatory Approvals Pending)
- 3750 Vrms for 1 min per UL1577
- CSA Component Acceptance
Applications
 Automatic Test Equipment
 Data Acquisition System
 Measuring Instrument
 EMR / Reed Relay Replacement
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.