ASMT-TWBM Datasheet, PDF (1/3 Pages) AVAGO TECHNOLOGIES LIMITED – Surface Mount LED Indicator

ASMT-TWBM / ASMT-TBBM / ASMT-TGBM
Surface Mount LED Indicator
Reliability Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accor-
dance with the latest revision of MIL-STD-883 and JEDEC.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on
the electrical and environmental characteristics of your
application but will probably be better than the perfor-
mance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship
between ambient temperature and actual junction tem-
perature is given by the following:
T_J(°C) = T_A(°C) + θ_JA P_AVG
Where;
T_A = ambient temperature in (°C)
θ_JA = thermal resistance of junction-to ambient in °C/watt
P_AVG = average power dissipated in watts
The estimated MTTF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature
acceleration. Results of such calculations are shown in the
table below using activation energy of 0.43eV (reference
MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Colors
Green
Blue / Ice Blue /
Cool White
Stress Test Conditions
T_A = 55°C, I_F = 20 mA
T_A = 55°C, I_F = 18 mA
Total Device
Hours
56,000
56,000
Units
Tested
56
56
Units
Failed
0
0
Point Typical Performance
MTBF
Failure Rate
(60% Confidence) (%/1K Hrs)
61,100
1.64
71,700
1.39