AMMC-6530 Datasheet, PDF (1/8 Pages) AVAGO TECHNOLOGIES LIMITED – 5–30 GHz Image Reject Mixer

AMMC-6530
5–30 GHz Image Reject Mixer
Data Sheet
Vg
drain
IF1
IF2
Chip Size: 1300 x 1400 µm
Chip Size Tolerance: ±10 µm (±0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
gate
Vg
Description
Avago’s AMMC-6530 is an image reject mixer that
­operates from 5 to 30 GHz. The cold channel FET mixer
is designed to be an easy-to-use component for any
chip and wire application. It can be used drain pumped
for low conversion loss applications, or when gate
pumped the mixer can provide high linearity for SSB
up‑conversion. An external 90‑degree hybrid is used
to achieve image rejection and a -1V voltage ­reference
is needed. Intended applications include ­ microwave
radios, 802.16, VSAT, and satellite receivers. Since this
one mixer can cover several bands, the AMMC-6530
can reduce part inventory. The ­integrated mixer elimi-
nates complex tuning and ­assembly ­processes typically
required by hybrid (discrete-FET or diode) mixers. For
improved reliability and moisture protection, the die is
passivated at the active areas.
Features
• Broad Band Performance 5–30 GHz
• Low Conversion Loss of 8 dB
• High Image Rejection of 15–20 dB
• Good 3rd Order Intercept of +18 dBm
• Single -1V, no current Supply Bias
Applications
• Microwave Radio Systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access (including 802.16 and
802.20 WiMax)
• WLL and MMDS loops
Absolute Maximum Ratings ^[1]
Symbol Parameters/Conditions
Units Min. Max.
V_g
Gate Supply Voltage
V
0
-3
P_in
CW Input Power
dBm
25
T_ch
Operating Channel Temperature
°C
+150
T_stg
Storage Case Temperature
°C
-65
+150
T_max
Max. Assembly Temp (60 sec max) °C
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent
damage to this device.
Attention: Observe precautions for
handling electrostatic ­sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.