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AMMC-5620_15 Datasheet, PDF (1/8 Pages) AVAGO TECHNOLOGIES LIMITED – 6 - 20 GHz High Gain Amplifier
AMMC-5620
6 - 20 GHz High Gain Amplifier
Data Sheet
Chip Size: 1410 x 1010 µm (55.5 x 39.7 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Avago Technologies’ AMMC-5620 MMIC is a GaAs wide-
band amplifier designed for medium output power and
high gain over the 6 - 20 GHz frequency range. The 3
cascaded stages provide high gain while the single bias
supply offers ease of use. It is fabricated using a PHEMT
integrated circuit process. The RF input and output ports
have matching circuitry for use in 50-Ω environments.
The backside of the chip is both RF and DC ground. This
helps simplify the assembly process and reduces assembly
related performance variations and costs. For improved
reliability and moisture protection, the die is passivated
at the active areas. The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
AMMC-5620 Absolute Maximum Ratings[1]
Features
• Frequency Range: 6 - 20 GHz
• High Gain: 19 dB Typical
• Output Power: 15dBm Typical
• Input and Output Return Loss: < -10 dB
• Positive Gain Slope: + 0.21dB/GHz Typical
• Single Supply Bias: 5 V @ 95 mA Typical
Applications
• General purpose, wide-band amplifier in communica-
tion systems or microwave instrumentation
• High gain amplifier
Symbol
VDD
IDD
Parameters/Conditions
Drain Supply Voltage
Total Drain Current
Units
Min.
V
mA
PDC
DC Power Dissipation
W
Pin
RF CW Input Power
dBm
Tch
Channel Temp.
°C
Tb
Operating Backside Temp.
°C
- 55
Tstg
Storage Temp.
°C
- 65
Tmax
Maximum Assembly Temp. (60 sec max)
°C
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Max.
7.5
135
1.0
20
+150
+165
+300
Note: These devices are ESD sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved carrier is used when dice are transported from one destination to
another. Personal grounding is to be worn at all times when handling these devices