ACPL-P302-000E Datasheet, PDF (1/14 Pages) AVAGO TECHNOLOGIES LIMITED – 0.4 Amp Output Current IGBT Gate Driver Optocouplers

ACPL-P302/W302
0.4 Amp Output Current IGBT Gate Driver Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The ACPL-P302/W302 consists of a GaAsP LED optically
coupled to an integrated circuit with a power output
stage. These optocouplers are ideally suited for driving
power IGBTs and MOSFETs used in motor control invert-
er applications. The high operating voltage range of the
output stage provides the drive voltages required by gate
controlled devices. The voltage and current supplied by
this optocoupler makes it ideally suited for directly driving
small or medium power IGBTs.
Applications
x Isolated IGBT/Power MOSFET gate drive
x AC and brushless DC motor drives
x Industrial inverters
x Inverter for home appliances
x Induction cooker
x Switching Power Supplies (SPS)
Functional Diagram
ANODE 1
N.C. 2
CATHODE 3
SHIELD
6 V_CC
5 V_O
4 V_EE
Truth Table
LED
VO
OFF LOW
ON
HIGH
Note: A 0.1 μF bypass
apacitor must be connected
between pins V_CC and V_EE.
Features
x High speed response.
x Ultra high CMR.
x Bootstrappable supply current.
x Available in Stretched SO-6 package
x Package Clearance/Creepage at 8mm (ACPL-W302)
x Safety Approval:
UL1577 recognized with 3750 Vrms for 1 minute for
ACPL-P302 and 5000 Vrms for 1 minute for ACPL-
W302.
CSA Approved.
IEC/EN/DIN EN 60747-5-2 Approved
V_IORM = 891 Vpeak for ACPL-P302
V_IORM = 1140 Vpeak for ACPL-W302
Specifications
x 0.4 A maximum peak output current.
x 0.2 A minimum peak output current.
x 0.7 μs maximum propagation delay over temperature
range.
x I_CC(max) = 3 mA maximum supply current.
x 10 kV/μs minimum common mode rejection (CMR) at
V_CM = 1000 V.
x Wide V_CC operating range: 10 V to 30 V over tempera-
ture range.
x Wide operating temperature range: –40°C to 100°C.
CAUTION: IT IS ADVISED THAT NORMAL STATIC PRECAUTIONS BE TAKEN IN HANDLING AND ASSEMBLY
OF THIS COMPONENT TO PREVENT DAMAGE AND/OR DEGRADATION WHICH MAY BE INDUCED BY ESD.