ACPL-M71U Datasheet, PDF (1/11 Pages) AVAGO TECHNOLOGIES LIMITED – Industrial CANBus communications interface

ACPL-M71U and ACPL-M72U
Wide Operating Temperature, High Speed, Low Power
Digital Optocouplers with R²Coupler™ Isolation
Data Sheet
Description
The Avago ACPL-M71U and ACPL-M72U are high tem-
perature, digital CMOS optocouplers in SOIC-5 packages.
These optocouplers use the latest CMOS IC technology
to achieve outstanding performance and very low power
consumption. All devices operate over the –40°C to 125 °C
temperature range.
The ACPL-M71U uses a high speed LED, and the
ACPL-M72U uses a low current LED for lower power dis-
sipation. The high speed ACPL-M71U featuring a 35 ns
maximum propagation delay (I_F =10 mA). The ACPL-M72U
optocoupler features very low power. With a low 4 mA
LED drive current, ACPL-M72U typical propagation delay
is 60 ns.
Each digital optocoupler has a CMOS detector IC, an in-
tegrated photodiode, a high speed transimpedance
amplifier, and a voltage comparator with an output
driver.
Avago R²Coupler isolation products provide the rein-
forced insulation and reliability needed for critical in high
temperature industrial applications
Functional Block Diagram
ACPL-M71U/ACPL-M72U
Anode ¹
6 Vdd
Features
 5 V CMOS compatible
 Common-Mode Rejection 40kV/s @ V_CM=1000V:
 Wide Industrial temperature range: –40°C to 125°C
 Low propagation delay :
– High Speed ACPL-M71U: 26ns @ I_F = 10 mA
(Typical)
– Low Power ACPL-M72U: 60ns @ I_F = 4 mA (Typical)
 Worldwide safety approval:
– UL 1577 recognized, 3750 Vrms / 1 min
– CSA approved
– IEC/EN/DIN EN 60747-5-5
Applications
 Industrial CANBus communications interface
 Industrial isolated high speed gate drivers for IGBTs
and Power MOSFETs
 High temperature digital signal isolation
 Microcontroller interface
 Digital isolation for A/D and D/A conversion
Cathode 3
5 _Vo
4 Gnd
Truth Table
LED Output (V_O)
OFF
H
ON
L
Note: A 0.1 F bypass capacitor must be connected between pins 4 and 6.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.