ACPL-K453 Datasheet, PDF (1/8 Pages) AVAGO TECHNOLOGIES LIMITED – High Speed Optocoupler

ACPL-K453
High Speed Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The ACPL-K453 is a single channel devices in an eight lead
miniature footprint.
This diode-transistor optocoupler uses an insulating layer
between the light emitting diode and an integrated pho-
to detector to provide electrical insulation between input
and output. Separate connections for the photodiode bias
and output transistor collector increase the speed up to a
hundred times over that of a conventional photo-transis-
tor coupler by reducing the base-collector capacitance.
The ACPL-K453 has a common mode transient immunity
of 15,000 V/Ps minimum at V_CM = 1500 V guaranteed.
Functional Diagram
NC 1
ANODE 2
CATHODE 3
NC 4
8 V _CC
7 NC
6 V_O
5 GND
TRUTH TABLE
LED
V_O
ON
LOW
OFF
HIGH
A 0.1 μF bypass capacitor between pins 5 and 8 is recommended.
Schematic
+ ^IF
ANODE
2
V_F
-
CATHODE
3
SHIELD
I_{CC 8}
V _CC
I_{O 6}
V_O
5
GND
Features
x Package Clearance/Creepage at 8mm
x Function Compatible with HCPL-4503
x Surface Mountable in 8-pin stretched SO8
x Very High Common Mode Transient Immunity: 15000
V/Ps at V_CM = 1500 V Guaranteed
x High Speed: 1 Mb/s
x TTL Compatible
x Guaranteed AC and DC Performance over Temperature:
0°C to 70°C
x Open Collector Output
x Safety approval
UL Recognized 5000 Vrms for 1 minute per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2 Approved V_IORM = 1140 V
peak
Applications
x Line Receivers - High common mode transient immu-
nity (>15000 V/Ps) and low input-output capacitance
(0.6 pF).
x High Speed Logic Ground Isolation - TTL/TTL, TTL/LTTL,
TTL/CMOS, TTL/LSTTL.
x Replace Slow Phototransistor Optocouplers
x Replace Pulse Transformers - Save board space and
weight
x Analog Signal Ground Isolation - Integrated photo de-
tector provides improved linearity over phototransistor
type.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.