AS8FLC2M32 Datasheet, PDF (1/29 Pages) Austin Semiconductor – Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array

AUSTIN SEMICONDUCTOR, INC.
Austin Semiconductor, Inc.
FLASH
AS8FLC2M32
Hermetic, Multi-Chip Module
(MCM)
64Mb, 2M x 32, 3.3Volt Boot Block FLASH
Array
FIGURE 1: PIN ASSIGNMENT
(Top View)
Available via Applicable Specifications:
• MIL-PRF-38534, Class H
FEATURES
• 64Mb device, total density, organized as 2M x 32
• Bottom Boot Block (Sector) Architecture
(Contact factory for top boot)
• Operation with single 3.0V Supply
• Available in multiple Access time variations
• Individual byte control via individual byte selects (CSx\)
• Low Power CMOS
• 1,000,000 Erase/Program Cycles
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Sector Architecture:
• One 16K byte, two 8K byte, one 32K byte and
thirty-one 64Kbyte sectors (byte mode)
• Any combination of sectors can be concurrently erased
• MCM supports full array (multi-chip) Erase
• Embedded Erase and Program Algorithms
• Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
• TTL Compatible Inputs and Outputs
• Military and Industrial operating temperature ranges
OPTION
MARKING
Access Speed
70ns
-70
90ns
-90
100ns
-100
120ns
-120
Package
Ceramic Quad Flat Pack
Q
Ceramic Hex Inline Pack
P
Temperature Range
Full Mil (MIL-PRF-38534, Class H) /Q
Military Temp (-55^oC to +125^oC) /XT
Industrial (-40^oC to +85^oC) /IT
For more products and information
please visit our web site at
www.austinsemiconductor.com
AS8FLC2M32B
Rev. 1.2 5/09
1
ID/OQ00
10
60
ID/OQ11
11
59
ID/0Q22
12
78
ID/OQ33
13
57
ID/OQ44
14
76
I_D/O_Q5₅
15
55
ID/OQ6
16
54
ID/OQ77
17
53
GND
18
52
ID/OQ88
19
51
ID/OQ99
20
50
DI/QO1100
21
49
D_I/Q_O1₁1₁
22
[Package Designator QT]
48
DI/0Q1122
23
47
D_I/Q_O1₁3₃
24
46
D_I/OQ1₁4₄
25
45
D_I/OQ1₁5₅
26
44
DI/QO1166
DI/QO1177
DI/QO1188
DI/OQ19
DI/QO2200
D^I/Q^O2²1¹
DI/QO2222
DI/QO2233
GND
DI/QO2244
DI/OQ25
DI/QO2266
DI/QO2277
DI/QO2288
DI/OQ29
DI/QO3300
DI/OQ31
Pin Assignment
(Top View)
ID/OQ88 Reset\ ID/OQ15
ID/OQ24 VCC ID/OQ331
ID/OQ99 CS2\ DI/QO144
ID/OQ225 CS4\ DI/OQ30
DI/OQ100 GND DI/QO133
DI/OQ266
NC ID/OQ29
A14 DI/OQ111 DI/OQ122
A7 ID/OQ27 ID/OQ28
A16 A10 OE\
A12
A4
A1
A11 A9
A17 _{66 HIP} AN2C0
A5
A2
A0
A15 WE\
A13
A6
A3
A18 VCC ID/OQ77
A8
NC ID/OQ223
ID/OQ0 CS1\ DI/OQ6
ID/OQ16 CS3\ DI/OQ22
DI/QO11 A19 DI/OQ5
DI/OQ177 GND ID/OQ21
ID/OQ2 DI/QO33 DI/OQ4
DI/QO188 DI/OQ19 DI/OQ200
[Package Designator PH]
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8FLC2M32B is a 64Mb
FLASH Multi-Chip Module organized as 2M x 32 bits. The
module achieves high speed access, low power consumption
and high reliability by employing advanced CMOS memory
technology. The military grade product is manufactured in
compliance to the MIL-PRF-38534 specifications, making the
AS8FLC2M32B ideally suited for military or space applications.
The module is offered in a 68-lead 0.990 inch square ceramic
quad flat pack or 66-lead 1.185inch square ceramic Hex In-line
Package (HIP). The CQFP package design is targeted for those
applications, which require low profile SMT Packaging.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.