AS8FLC1M32 Datasheet, PDF (1/27 Pages) Austin Semiconductor – Hermetic, Multi-Chip Module (MCM) 32Mb, 1M x 32, 3.0Volt Boot Block FLASH Array

AUSTIN SEMICONDUCTOR, INC.
Austin Semiconductor, Inc.
FLASH
AS8FLC1M32
Hermetic, Multi-Chip Module
(MCM)
32Mb, 1M x 32, 3.0Volt Boot Block FLASH
Array
FIGURE 1: PIN ASSIGNMENT
(Top View)
Available via Applicable Specifications:
• MIL-PRF-38534, Class H
FEATURES
• 32Mb device, total density, organized as 1M x 32
• Bottom Boot Block (Sector) Architecture
• Operation with single 3.0V Supply
• Available in multiple Access time variations
• Individual byte control via individual byte selects (CSx\)
• Low Power CMOS
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Sector Architecture:
• One 16K byte, two 8K byte, one 32K byte and
fifteen 64Kbyte sectors
• Any combination of sectors can be concurrently erased
• MCM supports full array (multi-chip) Erase
• Embedded Erase and Program Algorithms
• Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
• TTL Compatible Inputs and Outputs
• Military and Industrial operating temperature ranges
OPTION
MARKING
Access Speed
70ns
-70
90ns
-90
100ns
-100
120ns
-120
Package
Ceramic Quad Flat Pack
Q
Ceramic Hex Inline Pack
P
Temperature Range
Full Mil (MIL-PRF-38534, Class H) /Q
Military Temp (-55^oC to +125^oC) /XT
Industrial (-40^oC to +85^oC) /IT
For more products and information
please visit our web site at
www.austinsemiconductor.com
I/O0
10
60
I/O1
11
59
I/02
12
78
I/O3
13
57
I/O4
14
76
I/O5
15
55
I/O6
16
54
I/O7
17
53
GND
18
52
I/O8
19
51
I/O9
20
50
I/O10
21
49
I/O11
22
[Package Designator QT]
48
I/012
23
47
I/O13
24
46
I/O14
25
45
I/O15
26
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
Pin Assignment
(Top View)
I/O8 Reset\ I/O15
I/O24 VCC I/O31
I/O9 CS2\ I/O14
I/O25 CS4\ I/O30
I/O10 GND I/O13
I/O26
NC I/O29
A14 I/O11 I/O12
A7 I/O27 I/O28
A16 A10 OE\
A12
A4
A1
A11 A9
A17 _{66 HIP} NC
A5
A2
A0
A15 WE\
A13
A6
A3
A18 VCC I/O7
A8
NC I/O23
I/O0 CS1\ I/O6
I/O16 CS3\ I/O22
I/O1 A19 I/O5
I/O17 GND I/O21
I/O2 I/O3 I/O4
I/O18 I/O19 I/O20
[Package Designator PH]
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8FLC1M32B is a 32Mb
FLASH Multi-Chip Module organized as 1M x 32 bits. The
module achieves high speed access, low power consumption
and high reliability by employing advanced CMOS memory
technology. The military grade product is manufactured in
compliance to the MIL-PRF-38534 specifications, making the
AS8FLC1M32B ideally suited for military or space applications.
The module is offered in a 68-lead 0.990 inch square ceramic
quad flat pack or 66-lead 1.185inch square ceramic Hex In-line
Package (HIP). The CQFP package design is targeted for those
applications, which require low profile SMT Packaging.
AS8FLC1M32B
Rev. 3.3 05/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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