AS8E32K32 Datasheet, PDF (1/12 Pages) Austin Semiconductor – 32K x 32 EEPROM

AUSTIN SEMICONDUCTOR, INC.
AS8E32K32
32K x 32 EEPROM
EEPROM
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-94614: AS8E32K32
• MIL-STD-883
FEATURES
• Access times of 90, 120, 150 ns
• Built in decoupling caps for low noise
operation
• Organized as 32K x 32; User configurable
as 64K x 16 or 128K x 8
• Operation with single 5 volt supply
• Low power CMOS
• TTL Compatible Inputs and Outputs
OPTIONS
• Timing
90 ns
120 ns
150 ns
MARKINGS
-9
-12
-15
• Package
Ceramic Quad Flatpack Q
Pin Grid Array
P
No. 705
No. 805
PIN ASSIGNMENT (Top View)
66 Lead PGA
68 Lead CQFP
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8E32K32 is a 1 Megabit
EEPROM Modules organized as 32K x 32 bit. User configurable to
64K x16 or 128Kx 8. The module achieves high speed access, low
power consumption and high reliability by employing advanced
CMOS memory technology.
The military grade product is manufactured in compliance to
the SMD and MIL-STD 883, making the AS8E32K32 ideally suited
for military or space applications.
The module is offered in a 1.090 sq inch ceramic pin grid array
substrate. This package design provides the optimum space saving
CE4
solution for boards that accept through hole packaging.
WE4
The module is also offered as a 68 lead 0.990 sq. inch ceramic
quad flatpack. It has a max. height of 0.200 inch. This package
CE3
WE3
design is targeted for those applications which require low profile
SMT Packaging.
CE2
DEVICE IDENTIFICATION
WE2
An extra 64 bytes of EEPROM memory is available on each die
for user identification. By raising A9 to 12 V +/- 0.5V and using
CE1
WE1
address locations 7FC0H to 7FFFH the bytes may be written to
OE
A0 - 14
or read from in the same manner as the regular memory array.
M3
32K x 8
M2
32K x 8
M1
32K x 8
M0
32K x 8
I/O 24 - I/O 31
I/O 16 - I/O 23
I/O 8 - I/O 23
I/O 0 - I/O 7
AS8E32K32
REV. 1.5 9/99
1
Austin Semiconductor, Inc., reserves the right to change products or specifications without notice.