|
SA1316-H Datasheet, PDF (2/5 Pages) KODENSHI KOREA CORP. – Low power consumption type chip LED | |||
|
◁ |
SA1316-H
Absolute Maximum Ratings
Characteristic
Symbol
Rating
Power dissipation
PD
60
Forward current
IF
25
*1Peak forward current
IFP
50
Reverse voltage
VR
4
Operating temperature range
Topr
-25â¼80
Storage temperature range
Tstg
-30â¼100
*2Soldering temperature
Tsol
240°C for 10 seconds
*1. Duty ratio = 1/16, Pulse width = 0.1ms
*2. Recommended reflow soldering temperature profile
- Preheating 150â to 185â within 120 seconds soldering 240â within 10 seconds
Gradual cooling (Avoid quenching)
(Ta=25oC)
Unit
mW
mA
mA
V
°C
°C
Temp (â)
240
185
150
Peak Temp max. 240â
max. 10sec
Preheating area
150~185â, 90±30sec
Solder area
220â, max. 60sec
max. 3â/sec
max. -6â/sec
max. 4â/sec
Time from 25â to Peak Temperature max. 6min
25
0
60
150 180
240 Time (sec)
Electrical / Optical Characteristics
Characteristic
Symbol
Forward voltage
VF
*3Luminous intensity
IV
Peak wavelength
Spectrum bandwidth
Reverse current
*4Half angle
λP
âλ
IR
X
θ1/2
Y
Test Condition
IF= 20mA
IF= 20mA
IF= 20mA
IF= 20mA
VR=4V
IF= 20mA
Min
-
27
632
-
-
-
-
(Ta=25oC)
Typ Max Unit
2.0 2.4
V
-
155 mcd
635 641 nm
35
-
nm
-
10
uA
±65
-
deg
±70
-
KSD-O8G007-001
2
|
▷ |