ATS-X50450B-C1-R0 Datasheet, PDF (1/1 Pages) Advanced Thermal Solutions, Inc. – High Performance BGA Cooling

High Performance BGA Cooling
Solutions w/ superGRIP™ Attachment
ATS PART # ATS-X50450B-C1-R0
Features & Benefits
» Designed for 45 x 45 mm BGA components
» Requires minimal space around the component’s
perimeter; ideal for densely populated PCBs
» Allows the heat sink to be detached and reattached
without damaging the component or the PCB, an important
feature in the event a PCB may need to be reworked
» Strong, uniform attachment force helps achieve maximum
performance from phase-changing TIMs
» Eliminates the need to drill mounting holes in the PCB
» Assembly comes standard with a high performance
maxiFLOW™ heat sink which maximizes convection (air)
cooling
» Comes standard with clean break, reworkable, Chomerics
T-766 phase change material
W
L
FT
H
Thermal Performance
Air Velocity
FT/MIN
M/S
200
1.0
300
1.5
400
2.0
500
2.5
600
3.0
700
3.5
800
4.0
*Image above is for illustration purposes only.
Thermal Resistance
°C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW)
4
2.6
2.9
2.4
2.1
1.9
1.8
1.6
Product Details
LENGTH
45 mm
WIDTH
45 mm
HEIGHT
7.5 mm
FIN TIP to FIN TIP INTERFACE MATERIAL
FINISH
61.5 mm
Chomerics T766 BLUE-ANODIZED
Notes:
1) Length and width dimensions refer to the size of the component. Dimensions of the heat
sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
2) Thermal performance data are provided for reference only. Actual performance may vary
by application
3) ATS reserves the right to update or change its products without notice to improve the
design or performance
4) Additional tooling fees may be required
5) Typical lead time is a minimum of 4-6 weeks
6) Contact ATS to learn about custom options available
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); [phone] (Europe).
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